Die Level Services © 2021
AS9100 Service provider
MicroElectronicpackaging / AssemblySolutions Fast 4U
Providing custom Wire Bond Packaging solutions for those customers who only just want one. If you want more than just one, that's not a problem, we can do more if your project requires it, all you need to do is just ask and we will deliver!
We work with all types of board materials, FR4, Ceramic, Flex and plastic packages.
We can provide many types of IC package you need for your prototype devices, such as Open-
Chip ON Board assembly is our special unique technology in addition to our existing SMT and through hole PCB design, fabrication, and assembly expertise. We provide what the other EMS providers do not.
Flip Chip’s, yes Weflip4U when it comes to working with high frequency applications with serious compact dimensions, enabling higher I/O counts, short interconnection paths and smaller form factor.
What We Do 4U
Dimation is a privately-
With many years experience with this industry we have accumulated invaluable knowledge and insights which offer a distinct advantage to our customers and our Complexities who decide to let us help them be stronger with our help.
We are comply with ISO 13485 for Medical devices, Registered to AS9100D for aerospace as well as the IPC-