Providing custom Wire Bond Packaging solutions for those customers who only just want one. If you want more than just one, that's not a problem, we can do more if your project requires it, all you need to do is just ask and we will deliver!
CHIP ON FLEX
We work with all types of board materials, FR4, Ceramic, Flex and plastic packages.
IC PACKAGING
We can provide many types of IC package you need for your prototype devices, such as Open-Molded Plastic Packages, Open Cavity Plastic Packages, Ceramic IC packages, laminate Substrates and even custom IC package configurations.
IC ASSEMBLY
Chip ON Board assembly is our special unique technology in addition to our existing SMT and through hole PCB design, fabrication, and assembly expertise. We provide what the other EMS providers do not.
Flip Chip’s, yes Weflip4U when it comes to working with high frequency applications with serious compact dimensions, enabling higher I/O counts, short interconnection paths and smaller form factor.
Dimation is a privately-owned company, our company provides various amounts of technologies for our customers such as Engineering Services, Prototype Assembly, Low Volume Production Assembly Services, Conformal Coating, Box Build and Cable assemblies. We also specialize in Advanced Microelectronics, Micro Optics assembly services, assembly of complex electro-optic modules based on 'bare dies' from all sort of sectors and applications: from medical devices to communications, automotive, AR\VR, defense and more, our experience and expertise is in providing full Turnkey solutions for start-ups and R&D teams from prototype level to mass production.
With many years experience with this industry we have accumulated invaluable knowledge and insights which offer a distinct advantage to our customers and our Complexities who decide to let us help them be stronger with our help.
We are comply with ISO 13485 for Medical devices, Registered to AS9100D for aerospace as well as the IPC-A-610 & MILL-STD 883.
